Package Specification
Thermal
PACKAGE THERMAL DATA
PACKAGE DIMENSIONS IN mm (INCHES)
D
16 Lead
PDIP
42
16 Lead
SO Wide*
18
Data
Lead Count
Metric
Max Min
English
Max Min
RQJC typ
ûC/W
ûC/W
RQJA typ
80
75
16 Lead PDIP
16 Lead SO Wide*
19.69
10.50
18.67 .775 .735
10.10 .413 .398
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
REF: JEDEC MS-001
D
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
Ordering Information
Part Number
CS4172XN16
CS4172XDWF16
Description
16 Lead PDIP
16 Lead SO Wide*
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
CS4172XDWFR16 16 Lead SO Wide* (tape & reel)
*Internally Fused Leads
Rev. 4/19/99
© 1999 Cherry Semiconductor Corporation
6
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
