Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
D
PACKAGE THERMAL DATA
Thermal Data
16L PDIP*
20L SOIC*
Lead Count
Metric
English
RQJC
RQJA
typ
typ
15
50
9
ûC/W
ûC/W
Max Min Max Min
55
16L PDIP*
20L SOIC*
19.69 18.67
13.00 12.60
.775 .735
.512 .496
*Internally Fused Leads
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
REF: JEDEC MS-001
D
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
Ordering Information
Description
Part Number
CS4121ENF16
CS4121EDWF20
16L PDIP (internally fused leads)
20L SOIC (internally fused leads)
Ch erry Sem icon du ctor Corporation reserves th e
righ t to m ake ch an ges to th e specification s with ou t
n otice. Please con tact Ch erry Sem icon du ctor
Corporation for th e latest available in form ation .
CS4121EDWFR20 20L SOIC (internally fused leads)
(tape & reel)
Rev. 12/4/96
© 1999 Cherry Semiconductor Corporation
8
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
