Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Thermal Data
16 Lead
PDIP
16 Lead
SO
Lead Count
Metric
Max Min
English
RΘJC
RΘJA
typ
typ
42
80
23
105
˚C/W
˚C/W
Max Min
16L PDIP
16L SO
19.69
10.50
18.67 .775
.735
10.10 .413 .398
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
REF: JEDEC MS-001
D
All specs are the same.
Ordering Information
Part Number
Description
Ch erry Sem icon du ctor Corporation reserves th e
righ t to m ake ch an ges to th e specification s with ou t
n otice. Please con tact Ch erry Sem icon du ctor
Corporation for th e latest available in form ation .
CS3865CGN16
CS3865CGDW16
CS3865CGDWR16
16L PDIP
16L SO Wide
16L SO Wide (tape & reel)
© 1999 Cherry Semiconductor Corporation
Rev. 12/16/96
8
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
