Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
8 L 8L 14 L
Thermal Data
D
PDIP SO Narrow SO Narrow
Lead Count
Metric
English
RΘ
RΘ
typ
typ
52
45
165
30
125
˚C/W
˚C/W
JC
JA
Max
Min
9.02
4.80
8.55
Max Min
.400 .355
.197 .189
.344 .337
100
8 L PDIP
8 L SOIC Narrow
14L SOIC Narrow
10.16
5.00
8.75
Surface Mount Narrow Body (D); 150 mil wide
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
6.20 (.244)
5.80 (.228)
4.00 (.157)
3.80 (.150)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
1.57 (.062)
1.37 (.054)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
0.25 (.010)
0.19 (.008)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-001
D
0.25 (0.10)
0.10 (.004)
All specs are the same.
D
REF: JEDEC MS-012
Ordering Information
Part Number
CS3842BGN8
CS3842BGD8
CS3842BGDR8
CS3842BGD14
CS3842BGDR14
CS3843BGN8
CS3843BGD8
CS3843BGDR8
CS3843BGD14
CS3843BGDR14
Description
8L PDIP
8L SO Narrow
8L SO Narrow (tape & reel)
14L SO Narrow
14L SO Narrow (tape & reel)
8L PDIP
8L SO Narrow
8L SO Narrow (tape & reel)
14L SO Narrow
14L SO Narrow (tape & reel)
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
© 1999 Cherry Semiconductor Corporation
Rev. 6/23/99
6
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
