Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
D
PACKAGE THERMAL DATA
Thermal Data
8 Lead
PDIP
8 Lead
SO Narrow
Lead Count
Metric
English
RQJC
RQJA
typ
typ
52
45
ûC/W
ûC/W
Max
10.16
5.00
Min Max Min
100
165
8 Lead PDIP
8 Lead SO Narrow
9.02
4.80
.400 .355
.197 .189
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
REF: JEDEC MS-001
D
All specs are the same.
Surface Mount Narrow Body (D); 150 mil wide
6.20 (.244)
5.80 (.228)
4.00 (.157)
3.80 (.150)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
0.25 (.010)
0.19 (.008)
1.27 (.050)
0.40 (.016)
0.25 (0.10)
0.10 (.004)
D
REF: JEDEC MS-012
Ordering Information
Part Number
CS294GN8
CS294GD8
CS294GDR8
Description
8 Lead PDIP
8 Lead SO Narrow
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
8 Lead SO Narrow (tape & reel)
Rev. 1/20/99
© 1999 Cherry Semiconductor Corporation
4
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
