Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Thermal Data
14L PDIP
20L SOIC
Lead Count
Metric
English
RΘJC
typ
typ
48
85
17
90
°C/W
°C/W
Max
19.69
13.00
Min Max Min
18.67 .775 .735
12.60 .512 .496
RΘJA
14L PDIP
20L SO Wide
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
REF: JEDEC MS-001
D
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
Ordering Information
Part Number
CS289GDW20
CS289GDWR20 20 Lead SO Wide (tape & reel)
CS289GN14
Description
20 Lead SO Wide
Ch erry Sem icon du ctor Corporation reserves th e
righ t to m ake ch an ges to th e specification s with ou t
n otice. Please con tact Ch erry Sem icon du ctor
Corporation for th e latest available in form ation .
14 Lead PDIP
© 1999 Cherry Semiconductor Corporation
Rev. 6/22/99
6
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
