Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Thermal Data
8L PDIP
8L SO
Lead Count
Metric
English
Max Min
.400 .355
.197 .189
RQJC
RQJA
typ
typ
52
45
ûC/W
ûC/W
Max
Min
9.02
4.80
100
165
8L PDIP
8L SOIC
10.16
5.00
Surface Mount Narrow Body (D); 150 mil wide
6.20 (.244)
5.80 (.228)
4.00 (.157)
3.80 (.150)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
0.25 (.010)
0.19 (.008)
1.27 (.050)
0.40 (.016)
0.25 (0.10)
0.10 (.004)
D
REF: JEDEC MS-012
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
1.77 (.070)
1.14 (.045)
8.26 (.325)
7.62 (.300)
2.54 (.100) BSC
3.68 (.145)
2.92 (.115)
0.39 (.015)
MIN.
.356 (.014)
.203 (.008)
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
REF: JEDEC MS-001
D
All specs are the same.
Ordering Information
Part Number
CS2516KN8
CS2516KD8
CS2516KDR8
Description
8 Lead PDIP
8 Lead SOIC
Ch erry Sem icon du ctor Corporation reserves th e
righ t to m ake ch an ges to th e specification s with ou t
n otice. Please con tact Ch erry Sem icon du ctor
Corporation for th e latest available in form ation .
8 Lead SOIC (tape & reel)
Rev. 1/17/95
© 1999 Cherry Semiconductor Corporation
6
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
