FM120 THRU FM1200
High reliability test capabilities
Item Test
1. Solder Resistance
Conditions
Reference
MIL-STD-750D
METHOD-2031
at 260±5OC for 10±2sec.
immerse body into solder 1/16"±1/32"
at 245±5OC for 5 sec.
2. Solderability
MIL-STD-202F
METHOD-208
VR=80% rate at TJ=125OC for 168 hrs.
Rated average rectifier current at TA=25OC for 500hrs.
3. High Temperature Reverse Bias
4. Forward Operation Life
5. Intermittent Operation Life
6. Pressure Cooker
MIL-STD-750D
METHOD-1038
MIL-STD-750D
METHOD-1027
TA = 25OC, IF = IO
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
15PSIG at TA=121OC for 4 hrs.
-55OC to +125OC dwelled for 30 min.
7. Temperature Cycling
8. Thermal Shock
MIL-STD-750D
METHOD-1051
and transferred for 5min. total 10 cycles.
0OC for 5 min. rise to 100OC for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1056
8.3ms single half sine-wave superimposed
on rated load, one surge.
9. Forward Surge
MIL-STD-750D
METHOD-4066-2
at TA=85OC, RH=85% for 1000hrs.
at 175OC for 1000 hrs.
10. Humidity
MIL-STD-750D
METHOD-1021
11. High Temperature Storage Life
MIL-STD-750D
METHOD-1031
MDD ELECTRONIC
MDD [ Chendahang Electronics Co., Ltd ]
