CEP01N6G/CEB01N6G
CEF01N6G
Electrical Characteristics T = 25 C unless otherwise noted
c
4
Parameter
Off Characteristics
Symbol
Test Condition
Min
Typ
Max
Units
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate Body Leakage Current, Forward
Gate Body Leakage Current, Reverse
On Characteristics b
BVDSS
IDSS
VGS = 0V, ID = 250µA
VDS = 600V, VGS = 0V
VGS = 30V, VDS = 0V
VGS = -30V, VDS = 0V
600
V
20
µA
nA
nA
IGSSF
IGSSR
100
-100
Gate Threshold Voltage
Static Drain-Source
VGS(th)
RDS(on)
VGS = VDS, ID = 250µA
VGS = 10V, ID = 0.6A
2
4
V
7.3
9.3
Ω
On-Resistance
Dynamic Characteristics c
Forward Transconductance
Input Capacitance
gFS
Ciss
Coss
Crss
VDS = 15V, ID = 0.5A
10
S
210
55
pF
pF
pF
VDS = 25V, VGS = 0V,
f = 1.0 MHz
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics c
Turn-On Delay Time
25
td(on)
tr
td(off)
tf
20
11
ns
ns
26
VDD = 300V, ID = 1A,
VGS = 10V, RGEN =10Ω
14.3
Turn-On Rise Time
Turn-Off Delay Time
26
ns
33.8
24
Turn-Off Fall Time
18.5
7.2
1.7
4
ns
9.4
Total Gate Charge
Qg
nC
nC
nC
VDS = 300V, ID = 1A,
VGS = 10V
Gate-Source Charge
Qgs
Qgd
Gate-Drain Charge
Drain-Source Diode Characteristics and Maximun Ratings
f
IS
Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage b
1
A
V
VGS = 0V, IS = 0.5A g
1.5
VSD
Notes :
a.Repetitive Rating : Pulse width limited by maximum junction temperature .
b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2% .
c.Guaranteed by design, not subject to production testing.
d.Limited only by maximum temperature allowed .
e.Pulse width limited by safe operating area .
f.Full package I
= 0.9A .
S(max)
g.Full package V test condition I = 0.9A .
SD
S
2