CEM6200
Electrical Characteristics T = 25 C unless otherwise noted
c
Parameter
Off Characteristics
Symbol
Test Condition
Min
Typ
Max
Units
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate Body Leakage Current, Forward
Gate Body Leakage Current, Reverse
On Characteristics
BVDSS
IDSS
VGS = 0V, ID = 250µA
VDS = 60V, VGS = 0V
VGS = 20V, VDS = 0V
VGS = -20V, VDS = 0V
60
V
1
µA
nA
nA
IGSSF
IGSSR
100
-100
6
Gate Threshold Voltage
Static Drain-Source
VGS(th)
RDS(on)
VGS = VDS, ID = 250µA
VGS = 10V, ID = 1.5A
VGS = 4.5V, ID = 1.2A
1
3
V
188
207
230
270
mΩ
mΩ
On-Resistance
Dynamic Characteristics c
Forward Transconductance
Input Capacitance
gFS
Ciss
Coss
Crss
VDS = 5V, ID = 2.6A
10
230
45
S
pF
pF
pF
VDS = 25V, VGS = 0V,
f = 1.0 MHz
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics c
Turn-On Delay Time
25
td(on)
tr
td(off)
tf
8
16
4.8
ns
ns
VDD = 27.5V, ID = 2.3A,
VGS = 10V, RGEN = 3Ω
Turn-On Rise Time
2.4
16.7
1.6
2.4
0.8
1.1
Turn-Off Delay Time
33.4
3.2
ns
Turn-Off Fall Time
ns
Total Gate Charge
Qg
3.2
nC
nC
nC
VDS =27.5V, ID =2.1A,
VGS = 4.5V
Gate-Source Charge
Qgs
Qgd
Gate-Drain Charge
Drain-Source Diode Characteristics and Maximun Ratings
Drain-Source Diode Forward Current
Drain-Source Diode Forward Voltage b
IS
2.6
1.3
A
V
VSD
VGS = 0V, IS = 2.3A
Notes :
a.Repetitive Rating : Pulse width limited by maximum junction temperature.
b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.
c.Guaranteed by design, not subject to production testing.
2