TYPE
MODEL
PAGE
5/9
SMV0402E□□□□□□□□RR
de ng
CITATION
SUBJECT
DATE Feb. 13, 2009
S
o
l
ri
C01
REV.
5. SOLDERING RECOMMENDATIONS
5.1 Recommended solder pad layout
A
B
C
D
0.4~0.6
1.4~1.8
0.5~0.6
0.6~1.2
（
Unit：mm）
5.2 The SIR test of the solder paste shall be done
5.3 Steel plate and foot distance printing
（Based on JIS-Z-3284）
Foot distance printing (mm)
> 0.65mm
Steel Plate thickness (mm)
0.18mm
0.65mm~0.5mm
0.50mm~0.40mm
<=0.40 mm
0.15mm
0.12mm
0.10mm
5.4 IR Soldering
Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and
gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and
solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb
Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal
gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is
essential to minimize thermal shock.
CERAMATE [ CERAMATE TECHNICAL ]
