+PC2709TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View
IN
C
L
OUT
C
Mounting direction
V
CC
C
COMPONENT LIST
Value
Notes
1. 30 = 30 = 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
C
L
1 000 pF
300 nH
3. Solder plated on pattern
4.
: Through holes
For more information on the use of this IC, refer to the following application note:
USAGE AND APPLICATION OF SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E).
7
Data Sheet P12653EJ3V0DS00