S/ACC/5TH2xxx/A/12/09/2005
THERMAL Pads
For SC, SV and SO relays
Low thermal resistance
Easy to use
5TH21000 / 5TH23000
and 1LWP2300
For an efficient cooling of power components, it is usual to apply a thermally conducting
media, such as thermal grease, between the power element and the heatsink.
Thermal grease is considered problematic due to difficulties in applying it to the heat-
dissipating surface and also performances in the life of the product.
An alternative,
celduc
tested a range of products and compared their thermal resistance
characteristics (Rth c/h : Thermal Resistance between case to heatsink)
celduc
recommends Aluminium materials thermal pads with very good thermal
performances and no modification in the long term. (See comparison tests on last page):
5TH21000
And now in the same technology,
celduc
introduce an adhesive thermal PAD.
36.8mm
36.8mm
Glue on both
edges
5TH23000
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CELDUC [ celduc-relais ]
