NX5302 SERIES
ABSOLUTE MAXIMUM RATINGS1
PARAMETER DEFINITIONS
(TC = 25°C, unless otherwise specified)
Kink: kink
SYMBOLS
PARAMETERS
Optical Output Power
Forward Current of LD
Reverse Voltage of LD
Forward Current of PD
Reverse Voltage of PD
Operating Case Temperature
Storage Temperature
Assembly Temperature
UNITS RATINGS
Pf
IF
VR
IF
VR
mW
mA
V
mA
V
°C
°C
°C
10
150
2.0
10
20
P
O
|dPK|
x 100 [%]
kink =
(mW)
I
F
- PO
P
K
6.0
dP
K
= dPO MAX
dP
O
dP
K
PK ≤ 6.0 (mW)
PK
IF - ηd
TC
-40 to +85
-40 to +85
150 (15 Hr)
TSTG
TASB
TSLD
I
F
0
Lead Soldering
(mA)
Temperature (10 s)
°C
350 (3 sec.)
85
RH
Relative Humidity
(noncondensing)
%
Tracking Error: γ
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
P
O
(mW)
P
O
5.0
γ =
|10 log
|
[dB]
TC
= 25°C
5.0
TC = -40 to +85°C
PO
I
m
0
Im
(mA)
OUTLINE DIMENSIONS (Units in mm)
NX5302E SERIES
NX5302S SERIES
+0.00
-0.03
ø5.6
+0.00
ø5.6
-0.03
ø4.2±0.1
BOTTOM VIEW
ø4.2±0.1
BOTTOM VIEW
+0.1
ø3.55±0.05
ø3.55±0.1
0.3
-0.0
1.0±0.1
1.0±0.1
1
1
+0.1
-0.0
2
4
0.3
+0.1
2
4
0.3
-0.0
3
3
110°±2°
PIN CONNECTIONS
NX5302EJ NX5302EH
+0.1
0.3
-0.0
PIN CONNECTIONS
∆x = ±300 µm
∆y = ±300 µm
*1
1 (CASE)
Focal Point
1 (CASE)
ø1.6±0.1
LD
NX5302SH
NX5302SJ
ø2.0
LD
4
4
2
ø1.0 MIN
1 (CASE)
2
1 (CASE)
PD
LD
PD
LD
4
4
3
3
2
LD CHIP
REFERENCE
2
2
Reference Plane
NX5302EI
NX5302EK
1.2±0.1
PD
PLANE
PD
3
1 (CASE)
1 (CASE)
LD
3
1.27±0.1
ø0.45
(four places)
LD
4
2
NX5302SK
1 (CASE)
LD
NX5302SI
2
ø0.45
(4 places)
4
1 (CASE)
PD
PD
3
3
LD
4
ø2.0
ø2.0
P. C. D .
2
4
PD
PD
3
3
*1 Focal Point:
A point to get maximum optical output power from fiber.
*2: n = 1.48 Bolosilicate Glass
CEL [ CALIFORNIA EASTERN LABS ]
