NE5531079A
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260C or below
: 10 seconds or less
: 60 seconds or less
: 12030 seconds
: 3 times
Time at temperature of 220C or higher
Preheating time at 120 to 180C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260C or below
: 10 seconds or less
: 120C or below
: 1 time
WS260
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
Soldering time (per pin of device)
: 350C or below
HS350-P3
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet PU10752EJ01V0DS
CEL [ CALIFORNIA EASTERN LABS ]
