MPC8230TU
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance
difference.
(3) The bypass capacitor should be attached to VCC line.
(4) Do not supply DC voltage to INPUT pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220oC or higher
Preheating time at 120 to 180oC
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260oC or below
: 10 seconds or less
: 60 seconds or less
: 120p30 seconds
: 3 times
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120oC or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 260oC or below
: 10 seconds or less
WS260
HS350
: 1 time
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350oC or below
: 3 seconds or less
: 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
8
Data Sheet PU10612EJ01V0DS
CEL [ CALIFORNIA EASTERN LABS ]
