Package/Pinout "Y" and "Z"
MECHANICAL
DIP PACKAGE
SMD PACKAGE
1.285 0.010ꢀ
(32.64 0.25ꢁ
1.285 0.010ꢀ
(32.64 0.25ꢁ
2423 22
1514 13
2423 22
1514 13
0.695 0.015ꢀ
(17.65 0.38ꢁ
0.525 0.010ꢀ
(13.34 0.25ꢁ
0.525 0.010ꢀ
(13.34 0.25ꢁ
TOP VIEWS
HB01UxxyzzY
HB01UxxyzzZ
1
2
3
1011 12
1
2
3
1011 12
0.375 0.005ꢀ
(9.52 0.13ꢁ
0.375 0.005ꢀ
(9.52 0.13ꢁ
SIDE VIEWS
END VIEWS
0.015 0.005ꢀ
(0.38 0.13ꢁ
0.015 0.005ꢀ
(0.38 0.13ꢁ
0.020 0.002ꢀ
(0.51 0.05ꢁ
0.100 0.010ꢀ
(2.54 0.25ꢁ
0.020 0.002ꢀ
(0.51 0.05ꢁ
0.100 0.010ꢀ
(2.54 0.25ꢁ
0.125+0.030ꢀ
-0.000ꢀ
(3.18+0.76ꢁ
-0.00ꢁ
0.014 0.002ꢀ
(0.36 0.05ꢁ
0°-15°
.015 .010ꢀ
(.38 .25ꢁ
0.600ꢀ
(15.24ꢁ
(
NU = Do Not Use.
NC = No Internal Connection.
PIN CONNECTIONS
PIN# SINGLES DUALS
Duplicate pin functions are internally connected.
All dimensions are in inches (millimetersꢁ.
GRID: 0.100 inches (2.54 millimetersꢁ
1
2
3
+VOUT
-VOUT
NU
+VOUT
Common
-VOUT
10
11
12
-VIN
NC
+VIN
-VIN
NC
+VIN
Typically Marked with: specific model ordered, date code, job code and Logo.
MATERIAL: Units are encapsulated in a low thermal resistance molding
compound which has excellent chemical resistance, wide operating
temperature range, and good electrical properties under high humidity
environments. The encapsulant and outer shell of the unit have UL94V-0
ratings. Lead material is brass with a solder plated surface to allow ease of
solderability.
13
14
15
+VIN
NC
+VIN
NC
-VIN
-VIN
21
22
23
24
NC
NU
-VOUT
+VOUT
NC
-VOUT
Common
+VOUT
RECOMMENDED LAND PATTERN
RECOMMENDED REFLOW PROFILE
30 sec MAX
(>220°Cꢁ
0.100ꢀ
(2.54ꢁ
250
235 °C MAX
220
2423 22
151413
200
150
190
0.080ꢀ
(2.03ꢁ
0.730ꢀ
(18.54ꢁ
0.040ꢀ
(1.02ꢁ
100
1
2
3
10 11 12
90 sec MAX
(>190°Cꢁ
1.150ꢀ
(29.21ꢁ
50
TIME (secondsꢁ
HB01U 11/98 REV B
Page 3
CANDD [ C&D TECHNOLOGIES ]
