BS616LV1611
ORDERING INFORMATION
BS616LV1611
X
X
Z Y Y
SPEED
55: 55ns
PKG MATERIAL
G: Green, RoHS Compliant
GRADE
I: -40oC ~ +85oC
PACKAGE
F: BGA-48-0912
T: TSOP I-48
Note:
BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does
not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result
in significant injury or death, including life-support systems and critical medical instruments.
PACKAGE DIMENSIONS
NOTES:
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
SIDE VIEW
D
0.1
N
D
E
D1
E1
e
D1
3.375
48
12.0
9.0
5.25
3.75
0.75
SOLDER BALL 0.35 ±0.05
VIEW A
48 mini-BGA (9mm x 12mm)
Revision
2.4
2008
R0201-BS616LV1611
9
Oct.
BSI [ BRILLIANCE SEMICONDUCTOR ]
