ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per-
formance degradation to complete device failure. Burr-
Brown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
+VCC ..................................................................................................... +6V
Analog Input ........................................................... –0.3V to (+VCC + 0.3V)
Logic Input ............................................................. –0.3V to (+VCC + 0.3V)
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature ..................................................................... +125°C
External Reference Voltage .............................................................. +5.5V
NOTE: (1) Stresses above these ratings may permanently damage the device.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
PIN CONFIGURATION
VREF
+In
1
2
3
4
8
7
6
5
+VCC
DCLOCK
DOUT
ADS7816
–In
GND
CS/SHDN
8-Pin PDIP,
8-Lead SOIC,
8-Lead MSOP
PIN ASSIGNMENTS
PIN
NAME
DESCRIPTION
1
2
3
4
5
6
VREF
+In
Reference Input.
Non Inverting Input.
–In
Inverting Input. Connect to ground or to remote ground sense point.
Ground.
GND
CS/SHDN
DOUT
Chip Select when LOW, Shutdown Mode when HIGH.
The serial output data word is comprised of 12 bits of data. In operation the data is valid on the falling edge of DCLOCK. The
second clock pulse after the falling edge of CS enables the serial output. After one null bit the data is valid for the next 12 edges.
Data Clock synchronizes the serial data transfer and determines conversion speed.
7
8
DCLOCK
+VCC
Power Supply.
PACKAGE/ORDERING INFORMATION
MAXIMUM
INTEGRAL
LINEARITY ERROR
MAXIMUM
DIFFERENTIAL
LINEARITY ERROR
(LSB)
PACKAGE
DRAWING
NUMBER(1)
TEMPERATURE
RANGE
PRODUCT
(LSB)
PACKAGE
ADS7816P
ADS7816U
ADS7816E
ADS7816PB
ADS7816UB
ADS7816EB
ADS7816PC
ADS7816UC
ADS7816EC
±2
±2
±2
±2
±2
±2
±1
±1
±1
±2
±2
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Plastic DIP
SOIC
006
182
337
006
182
337
006
182
337
±2
MSOP
±1
Plastic DIP
SOIC
±1
±1
MSOP
±0.75
±0.75
±0.75
Plastic DIP
SOIC
MSOP
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
3
ADS7816
BB [ BURR-BROWN CORPORATION ]
