ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
VEE to Digital Common....................................................... +VDD to –16.5V
VDD to Digital Common .............................................................. 0V to +7V
Analog Common to Digital Common .................................................... ±1V
Control Inputs (CE, CS, AO, 12/8, R/C)
to Digital Common .................................................. –0.5V to VDD +0.5V
Analog Inputs (Ref In, Bipolar Offset, 10VIN
)
to Analog Common ...................................................................... ±16.5V
20VIN to Analog Common .................................................................. ±24V
Ref Out.......................................................... Indefinite Short to Common,
Momentary Short to VDD
Max Junction Temperature ............................................................ +165°C
Power Dissipation ........................................................................ 1000mW
Lead Temperature (soldering,10s) ................................................. +300°C
Thermal Resistance, θJA : Plastic DIPs ........................................ 100°C/W
SOIC ................................................... 100°C/W
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
TEMPERATURE
LINEARITY
ERROR
PACKAGE DRAWING
NUMBER(2)
PRODUCT
SINAD(1)
RANGE
PACKAGE
ADS774JE
ADS774KE
ADS774JP
ADS774KP
ADS774JU
ADS774KU
68dB
70dB
68dB
70dB
68dB
70dB
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
±1LSB
±1/2LSB
±1LSB
±1/2LSB
±1LSB
28-Pin 0.3" Plastic DIP
28-Pin 0.3" Plastic DIP
28-Pin 0.6" Plastic DIP
28-Pin 0.6" Plastic DIP
28-Lead SOIC
246
246
215
215
217
217
±1/2LSB
28-Lead SOIC
NOTES: (1) SINAD is Signal-to-(Noise + Distortion) expressed in dB. (2) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-
Brown IC Data Book.
CONNECTION DIAGRAM
+5VDC Supply
(VDD
Power-Up Reset
1
28
27
STATUS
)
–
12/8
2
3
4
5
6
DB11 (MSB)
Control
Logic
CS
AO
26 DB10
Clock
25
24
DB9
DB8
–
R/C
CE
23
DB7
22 DB6
21 DB5
NC*
7
8
12
Bits
2.5V Ref
Out
2.5V
Reference
12 Bits
Analog
Common
20
19 DB3
18
9
DB4
2.5V Ref
In
10
VEE 11
DB2
17 DB1
Bipolar 12
Offset
–
+
10V Range 13
16 DB0 (LSB)
CDAC
20V Range
14
15 Digital
Common
*Not Internally Connected
®
ADS774
4
BB [ BURR-BROWN CORPORATION ]
