ꢆ
ꢠ
ꢀ
ꢡ
ꢢ
ꢢ
www.ti.com
SBOS383A − FEBRUARY 2007
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
(1)
ABSOLUTE MAXIMUM RATINGS
handledwith appropriate precautions. Failure to observe
Power Supply, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V
S
proper handling and installation procedures can cause damage.
Input Voltage, pins 2, 3, 4 only . . . . . . . . . . . . . −0.5V to V + 0.5V
S
Input Voltage, pins 6, 7, 8 only . . . . . . . . . . . . . . . . . . . −0.5V to 7V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +127°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +130°C
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
Junction Temperature (T max) . . . . . . . . . . . . . . . . . . . . . . +150°C
J
ESD Rating:
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . 3000V
Charged Device Model (CDM) . . . . . . . . . . . . . . . . . . . . 1000V
Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(1)
ORDERING INFORMATION
PACKAGE
DESIGNATOR
PACKAGE
MARKING
2
PRODUCT
DESCRIPTION
I C ADDRESS
PACKAGE-LEAD
MSOP-8
DGK
D
411A
T411A
411B
TMP411A
Remote Junction Temperature Sensor
100 1100
100 1101
(2)
SO-8
MSOP-8
(2)
DGK
D
TMP411B
Remote Junction Temperature Sensor
SO-8
T411B
(1)
(2)
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
Available Q1 2007.
PIN CONFIGURATION
PIN ASSIGNMENTS
PIN
NAME
DESCRIPTION
Top View
MSOP, SO
1
V+
Positive supply (2.7V to 5.5V)
Positive connection to remote temperature
sensor
2
3
D+
D−
Negative connection to remote temperature
sensor
TMP411
Thermal flag, active low, open-drain;
requires pull-up resistor to V+
SCL
SDA
V+
D+
1
2
3
4
8
7
6
5
4
5
THERM
GND
Ground
ALERT/THERM2
GND
−
D
Alert (reconfigurable as second thermal
flag), active low, open-drain; requires
pull-up resistor to V+
6
ALERT/THERM2
THERM
Serial data line for SMBus, open-drain;
requires pull-up resistor to V+
7
8
SDA
SCL
Serial clock line for SMBus, open-drain;
requires pull-up resistor to V+
2
BB [ BURR-BROWN CORPORATION ]
