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ANM1730 参数 Datasheet PDF下载

ANM1730图片预览
型号: ANM1730
PDF下载: 下载PDF文件 查看货源
内容描述: 所有组件内的SiP [All Components Inside SiP]
分类和应用:
文件页数/大小: 3 页 / 231 K
品牌: ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
 浏览型号ANM1730的Datasheet PDF文件第1页浏览型号ANM1730的Datasheet PDF文件第2页  
ANM1730  
Internally Matched LNA Module  
Mounting Recommendation (in mm)  
Note: 1. The number and size of ground via holes in a  
circuit board is critical for thermal and RF groun  
ding considerations.  
2. We recommend that the ground via holes be p  
laced on the pad of the device for better RF a  
nd thermal performance, as shown in the drawi  
ng at the left side.  
S-parameters & K-factor  
0
-5  
40  
35  
30  
25  
20  
15  
10  
5
-10  
-15  
-20  
-25  
-30  
-35  
0
1000  
1500  
2000  
2500  
3000  
3500  
1000  
1500  
2000  
2500  
3000  
3500  
Frequency(MHz)  
Frequency(MHz)  
10  
0
9
8
7
6
5
4
3
2
1
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
0
1000  
2000  
3000  
4000  
5000  
6000  
7000  
1000  
1500  
2000  
2500  
3000  
3500  
Frequency[MHz]  
Frequency(MHz)  
3/3  
ASB Inc.  
·
sales@asb.co.kr  
·
Tel: +82-42-528-7223  
January 2013