AME
Low Dropout
300mA CMOS Regulator
AME8818
n Thermal Information
Parameter
Package
Die Attach
Symbol
Maximum
Unit
Conductive
Epoxy
81
Thermal Resistance*
(Junction to Case)
qJC
Non-Conductive
Epoxy
140
260
280
400
400
oC / W
Conductive
Epoxy
Thermal Resistance
(Junction to Ambient)
SOT-25
SOT-23
qJA
Non-Conductive
Epoxy
Conductive
Epoxy
PD
Internal Power Dissipation
mW
Non-Conductive
Epoxy
oC
oC
Maximum Junction Temperature
Solder Iron (10Sec)**
150
350
* Measure qJC on center of molding compound if IC has no tab.
** MIL-STD-202G 210F
6
Rev.A.01