欢迎访问ic37.com |
会员登录 免费注册
发布采购

ACT8332_10 参数 Datasheet PDF下载

ACT8332_10图片预览
型号: ACT8332_10
PDF下载: 下载PDF文件 查看货源
内容描述: 三通道集成电源管理IC,适用于手持便携式设备 [Three Channel Integrated Power Management IC for Handheld Portable Equipment]
分类和应用: 便携式便携式设备
文件页数/大小: 13 页 / 291 K
品牌: ACTIVE-SEMI [ ACTIVE-SEMI, INC ]
 浏览型号ACT8332_10的Datasheet PDF文件第5页浏览型号ACT8332_10的Datasheet PDF文件第6页浏览型号ACT8332_10的Datasheet PDF文件第7页浏览型号ACT8332_10的Datasheet PDF文件第8页浏览型号ACT8332_10的Datasheet PDF文件第10页浏览型号ACT8332_10的Datasheet PDF文件第11页浏览型号ACT8332_10的Datasheet PDF文件第12页浏览型号ACT8332_10的Datasheet PDF文件第13页  
ACT8332  
Rev1, 24-May-10  
STEP-DOWN DC/DC CONVERTER  
Figure 4:  
Output Voltage Programming  
Finally choose CFF using the following equation:  
2.2 ×10 6  
CFF  
=
(2)  
RFB1  
where RFB1 = 47k, use 47pF.  
PCB Layout Considerations  
High switching frequencies and large peak currents  
make PC board layout an important part of step-  
down DC/DC converter design. A good design mini-  
mizes excessive EMI on the feedback paths and volt-  
age gradients in the ground plane, both of which can  
result in instability or regulation errors. Step-down  
DC/DCs exhibit discontinuous input current, so the  
input capacitors should be placed as close as possi-  
ble to the IC, and avoiding the use of vias if possible.  
The inductor, input filter capacitor, and output filter  
capacitor should be connected as close together as  
possible, with short, direct, and wide traces. The  
ground nodes for each regulator's power loops  
should be connected at a single point in a star-  
ground configuration, and this point should be con-  
nected to the backside ground plane with multiple  
vias. For fixed output voltage options, connect the  
output node directly to the FB1 pin. For adjustable  
output voltage options, connect the feedback resis-  
tors and feed-forward capacitor to the FB1 pin  
through the shortest possible route. In both cases,  
the feedback path should be routed to maintain suffi-  
cient distance from switching nodes to prevent noise  
injection. Finally, the exposed pad should be directly  
connected to the backside ground plane using multi-  
ple vias to achieve low electrical and thermal resis-  
tance.  
Innovative PowerTM  
ActivePMUTM is a trademark of Active-Semi.  
- 9 -  
www.active-semi.com  
Copyright © 2010 Active-Semi, Inc.