MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
6.4.16 Die type............................................................................................................................................................36
6.4.17 Radiation hardness assurance (RHA)..............................................................................................................36
6.4.18 Electrostatic discharge (ESD) sensitivity..........................................................................................................36
6.4.19 Package family.................................................................................................................................................36
6.4.20 Technology flow ...............................................................................................................................................36
6.4.21 Qualified Manufacturer's Listing (QML)............................................................................................................36
6.4.22 Third party design center..................................................................................................................................36
6.4.23 Radiation source of supply (RSS) ....................................................................................................................36
6.4.24 Form.................................................................................................................................................................36
6.4.25 Fit.....................................................................................................................................................................36
6.4.26 Function ...........................................................................................................................................................36
6.4.27 Class M............................................................................................................................................................37
6.4.28 Class N.............................................................................................................................................................37
6.4.29 Class Q ............................................................................................................................................................37
6.4.30 Class V.............................................................................................................................................................37
6.4.31 Class Y.............................................................................................................................................................37
6.4.32 Class B.............................................................................................................................................................37
6.4.33 Class S.............................................................................................................................................................37
6.4.34 Class T.............................................................................................................................................................37
6.4.35 Qualified manufacturer’s line............................................................................................................................37
6.4.36 Test optimization..............................................................................................................................................37
6.4.37 Audit team........................................................................................................................................................37
6.4.38 Class level B ....................................................................................................................................................37
6.4.39 Class level S ....................................................................................................................................................37
6.4.40 Class level vs Class .........................................................................................................................................38
6.4.41 Second party facility.........................................................................................................................................38
6.4.42 Third party facility.............................................................................................................................................38
6.4.43 New technology................................................................................................................................................38
6.4.44 Mature technology............................................................................................................................................38
6.4.45 Lot date code ...................................................................................................................................................38
6.4.46 Storage temperature ........................................................................................................................................38
6.4.47 Multi-product wafer(MPW)................................................................................................................................38
6.4.48 Package integrity demonstration test plan(PIDTP)...........................................................................................38
6.5 Discussion.............................................................................................................................................................39
6.6 Additional reference documents............................................................................................................................41
6.7 Subject term (key word) listing ..............................................................................................................................42
6.8 List of acronyms....................................................................................................................................................43
6.9 Environmentally preferable material......................................................................................................................45
6.10 Changes from previous issue..............................................................................................................................45
A.1 SCOPE.................................................................................................................................................................46
A.1.1 Scope.................................................................................................................................................................46
A.2 APPLICABLE DOCUMENTS................................................................................................................................46
A.2.1 General..............................................................................................................................................................46
A.2.2 Government documents.....................................................................................................................................46
A.2.2.1 Specifications, standards, and handbooks......................................................................................................46
A.2.2.2 Other Government documents, drawings, and publications............................................................................47
A.2.3 Non-Government publications ...........................................................................................................................47
A.2.4 Order of precedence..........................................................................................................................................48
A.3 REQUIREMENTS.................................................................................................................................................48
A.3.1 General..............................................................................................................................................................48
A.3.1.1 Reference to device specification or drawing..................................................................................................48
A.3.1.2 Conflicting requirements .................................................................................................................................49
A.3.1.3 Terms, definitions, symbols and requirements................................................................................................49
A.3.1.3.1 Microelectronics...........................................................................................................................................49
A.3.1.3.2 Element (of a microcircuit or integrated circuit)............................................................................................49
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ACTEL [ Actel Corporation ]
