1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings (for 2.5V/3.3V/5.0V operating conditions). 4/
DC supply voltage range (V
DC supply voltage range (V
) ....................................................... -0.3 to +6.0 V dc
CCI
) ...................................................... -0.3 to +3.0 V dc
CCA
Input voltage range (V ) .................................................................... -0.5 to +6.0 V dc
I
Input voltage(VI) for bi-directional I/Os when using 3.3V PCI ............ -0.5 to (+V
Output voltage range (V ) ................................................................ -0.5 to (+V
+0.5) V dc
+0.5) V dc
CCI
CCI
O
Storage temperature range (V
) .................................................. -65 oC to +150 oC
STG
Lead temperature (soldering, 10 seconds) ....................................... 300 oC
Thermal resistance, junction-to-case (Θ for Case X and Y) .......... 0.5 oC/W
JC
Maximum junction temperature (T ) ................................................. 150 oC
J
1.4 Recommended operating conditions.
3.3V power supply voltage range ...................................................... 3.0 to 3.6 V dc (±10% V
5.0V power supply voltage range ...................................................... 4.5 to 5.5 V dc (±10% V
)
)
CCI
CCI
2.5V power supply voltage range ...................................................... 2.25 to 2.75 V dc (±10% V
)
CCA
Case operating temperature range (T ) ........................................... -55 oC to +125 oC
C
Input transition time T and T ........................................................ 10 ns 5/
R
F
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) .................................... 100 percent 6/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the
Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
4/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
5/ If T and T exceeds the limit of 10 ns, the device manufacturer cannot guarantee device functionality.
R
F
6/ 100 percent test coverage of blank programmable logic devices.
SIZE
STANDARD
5962-01515
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
3
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
