SPECIFICATION FOR APPROVAL
REF :
20090527-A
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
MB□□□□□□□□L□-□□□
HIGH CURRENT MULTILAYER
CHIP BEAD
A
Ⅰ﹒CONFIGURATION
& DIMENSIONS:
D
D
I
C
G
I
( PCB Pattern )
B
Unit : m/m
C
1.5±0.2
1.6±0.2
1.1±0.2
0.9±0.2
0.8±0.2
D
0.6±0.4
0.6±0.4
0.6±0.4
0.5±0.3
0.3±0.2
G
3.0
3.0
2.2
1.0
0.7
H
3.0
1.4
1.4
1.0
0.7
I
1.5
1.5
1.1
1.0
0.7
Series
MB4532
MB4516
MB3261
MB2029
MB1608
A
4.5±0.2
4.5±0.2
3.2±0.2
2.0±0.2
1.6±0.2
B
3.2±0.2
1.6±0.2
1.6±0.2
1.2±0.2
0.8±0.2
Ⅱ﹒SCHEMATIC
DIAGRAM:
Ⅲ﹒MATERIALS:
a﹒Body:Ferrite
b﹒Internal conductor:Silver or Ag / Pd
c﹒Terminal:Ag/Ni/Sn
d﹒Remark:Products comply with RoHS'
requirements
a
b
c
Ⅳ﹒GENERAL
SPECIFICATION:
a﹒Storage temp.:-40℃ ---- +105℃
b﹒Operating temp.:-55℃ ---- +125℃
c﹒Terminal strength:
F
Type
MB4532
MB4516
MB3261
MB2029
MB1608
d﹒Solderability:
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
F ( kgf )
1.5
1.0
1.0
0.6
0.5
Time ( sec )
250
Peak Temp:260℃ max.
Max time above 230℃
:50sec
max.
Max time above 200℃
:70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120 sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
50sec max.
230
℃
30±5
Temperature (
℃
)
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
H
250