SPECIFICATION FOR APPROVAL
REF : 20090527-A
PROD.
PAGE: 3
ABC'S DWG NO.
ABC'S ITEM NO.
MB□□□□□□□□L□-□□□
HIGH CURRENT MULTILAYER
CHIP BEAD
NAME
Ⅵ﹒PACKAGING INFORMATION：
( 1 ) Configuration
T
Cover Tape
2.0±0.5
∮C
G
Embossed Carrier
※Carrier tape width : D
P:4 m/m
4 m/m
End
Start
Leader
no component
200 m/m min.
Trailer
no component
400 m/m min.
Components
User direction of feed
Unit:m/m
( 2 ) Dimensions
Style
A
B
C
D
8
G
N
T
+0
-0
-0
07 - 08
07 - 12
178
178
21±0.8
21±0.8
13
13
10
14
50
50
12.5
16.5
+0
12
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Outer : Cartion
Series
Q'TY (pcs)
G.W. (gw)
Style
Q'TY(kpcs)
G.W. (Kg)
Size (cm)
MB4532
MB4516
MB3261
MB2029
MB1608
1,000
2,000
3,000
4,000
4,000
170
180
150
120
90
07 - 12
07 - 12
07 - 08
07 - 08
07 - 08
30
80
120
200
200
9.3
9.7
8.5
8.5
7.0
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
