SPECIFICATION FOR APPROVAL
REF : 20090825-B
PROD.
PAGE: 5
ABC'S DWG No.
ABC'S ITEM No.
HP1205□□□□2□-□□□
SHIELDED SMD
NAME
POWER INDUCTOR
Ⅷ﹒RELIABILITY TEST:
Test item
Specification
Test condition
Preconditioning: 150℃/16Hrs±30min Dry Bake
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent
Solder temp. :245±5℃
More than 95% of the
terminal electrode
Shall be covered
Solderability
Flux : Rosin
With fresh solder.
Dip time: 5±0.5sec
Electrical oharacteristics shall
not change more
Room temp.
15 minutes
-55 ℃
30 minutes
Thermal shock test
( Temp. cycle )
than ±20%
Room temp.
15 minutes
+125 ℃
30 minutes
Total : 50 cycles
Temperature : 40±2℃
Humidity : 90±5%
Time : 1000 hours
Humidity Test
Temperature : 125±5℃
Applied current : Per spec.
Time : 96 hours
High temp.
Resistance test
AR-001A