SPECIFICATION FOR APPROVAL
REF. :
PROD.
NAME
ABC'S DWG NO.
CM4532□□□□L□-□□□
PAGE
1
Wound chip Inductor
REV.
20121210-I
Ⅰ﹒Configuration
and dimensions：
3R3K
Marking
Inductance code
D
C
F
A
F
E
B
I
G
I
（
PCB Pattern
）
Unit：m/m
A
4.50
±0.3
B
3.20
±0.2
C
3.20
±0.2
D
4.20
±0.2
E
1.20
F
1.00 +0.3
-0.0
G
2.20
H
1.60
H
I
1.50
Ⅱ﹒Description：
a﹒Ferrite drum core construction.
b﹒Enamelled copper wire：H class
c﹒Product weight： 0.110 g（ref.）
d﹒Moisture sensitivity Level 3
e﹒Products comply with RoHS' requirements
Ⅲ﹒General
specification：
a﹒Temp. rise
：20℃
max.
b﹒Ambient temp.：100℃ max.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+125℃
(Temp. rise included)
e﹒Terminal pull strength：1.5 kg min.
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：250℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
AR-001C
Temperature (
℃
)
250
245
217
200
150
100
50
Reflow profile
Peak Temp：250℃ max.
Max time above 245℃
：20~40sec
max.
Max time above 217℃
：60~150sec
max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
Temperature
Rising Area
Preheat Area
150 ~ 200
℃
/ 60 ~ 180sec
Reflow Area
Forced Cooling Area
6
℃
/ second max.
Peak Temperature：
250℃
20~40sec
60~150sec
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
