SPECIFICATION FOR APPROVAL
REF : 20070320-A
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CB5009□□□□L□-□□□
SMD POWER INDUCTOR
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A : 5.60±0.15
B : 6.00 max.
C : 0.90±0.10
D : 1.50±0.30
E : 1.40±0.20
F : 2.00 ref.
G : 6.00 ref.
H : 1.50 ref.
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
4 R 7
B
E
C
G
D
F
H
(PCB Pattern Suggestion)
Ⅱ﹒SCHEMATIC
DIAGRAM：
b
a
c
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite core
b﹒Wire：Enamelled copper wire
c﹒Base：Cu/Ag(1.0um)
d﹒Adhesive：Epoxy resin
e﹒Remark：Products comply with RoHS'
requirements
Temperature (
℃
)
d
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260℃
250
50sec max.
230℃
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：40℃
typ.
b﹒Storage temp.：-40℃ ----+120℃
c﹒Operating temp.：-40℃----+125℃
(included Temp. rise)
d﹒Resistance to solder heat：260℃.10 secs.
AR-001A
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
