SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
PAGE: 5
ABC'S DWG No.
ABC'S ITEM No.
AL1608□□□□L□-□□□
THIN FILM CHIP INDUCTOR
NAME
Ⅷ﹒RELIABILITY TEST：
Test item
Specification
Test condition
More than 95% of the
terminal electrode
Shall be covered
Preheat : 155℃ / 4 hours.
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent
Solder temp. : 235±5℃
Solderability
With fresh solder.
Flux : Rosin
Dip time : 5±0.5 seconds
Electrical oharacteristics shall Room temp.
-55 ℃
not change more
15 minutes
30 minutes
Thermal shock test
( Temp. cycle )
than ±20%
Room temp.
15 minutes
+125 ℃
30 minutes
Total : 50 cycles
Temperature : 40±2℃
Humidity : 90±5%
Time : 1000 hours
Humidity Test
Temperature : 125±5℃
Applied current : Per spec.
Time : 96 hours
High temp.
Resistance test
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
