COM-QM77 Rev. B
Dimension
Unit: mm
Block Diagram
Optional Accessories
•ꢀTF-ECB-917T-A10
COM Express Type 6 Carrier Board, Mini-ITX, Dual Gigabit Ethernet, 2.1CH Audio, 4 COM, USB3.0, PCI-
Express, AT/ATX, Rev. A1.0
TX/RX x 2
LPC
SMbus
USB 3.0
•ꢀPER-A122
USB3.0 x 4
Heat Spreader, For COM-QM77, Onboard CPU
SATA2.0 x 2
SATA3.0 x 2
SATA
•ꢀPER-A115
Intel® 82579LM
DIO
CPU Cooler, 45W, for COM Express Basic Size. To be used with Heat Spreader
GbE
8-bits
USB 2.0
USB2.0 x 8
Audio
HDA
PCI Express
PEG
DDI
PCIe[x1] x 7
PCIe[x16]
DDI x 2
LCD
18/24-bit LVDS
CRT
Analog
Ordering Information
Part Number
COM Express Type Chipset
CPU
Memory
Display
LVDS
Storage
LAN
USB
UART
Expansion Slot
Power
Temp.
3rd Generation Intel® Core™ i7-
3555LE/2.5GHz (FCBGA1023)
DDR3 SODIMM x 2 CRT, LVDS,
Max.16GB HDMI, DP, DVI
SATA3 x 2
SATA2 x 2
USB3.0 x 4
USB2.0 x 8
COM-QM77-B10
6 (COM.0 Rev.2.0)
6 (COM.0 Rev.2.0)
6 (COM.0 Rev.2.0)
QM77
QM77
HM76
24-bit Dual Channel
GbE x 1
2 (TX/RX) PCI-E [16] x 1,PCI-E [1] x 7 12V
2 (TX/RX) PCI-E [16] x 1, PCI-E [1] x 7 12V
2 (TX/RX) PCI-E [16] x 1, PCI-E [1] x 7 12V
0°C ~ 60°C
3rd Generation Intel® Core™ i7-
3517UE/1.7GHz (FCBGA1023)
DDR3 SODIMM x 2 CRT, LVDS,
Max.16GB HDMI, DP, DVI
SATA3 x 2
SATA2 x 2
USB3.0 x 4
USB2.0 x 8
COM-QM77-B10-01
COM-QM77-B10-02
24-bit Dual Channel
24-bit Dual Channel
GbE x 1
GbE x 1
0°C ~ 60°C
0°C ~ 60°C
3rd Generation Intel® Core™ i3-
3217UE/1.6GHz (FCBGA1023)
DDR3 SODIMM x 2 CRT, LVDS,
Max.16GB HDMI, DP, DVI
SATA3 x 2
SATA2 x 2
USB3.0 x 4
USB2.0 x 8
06-2
AAEON [ AAEON TECHNOLOGY ]
