IMP5226
1
Pin Configuration
SOWB-28
SSOP-28
DISCONNECT
1
2
3
4
5
6
7
8
9
28 GND
DISCONNECT
1
2
3
4
5
6
7
8
9
28 GND
27 T18
26 T17
25 T16
24 T15
T1
27 T18
T1
T2
26 T17
T2
T3
25 T16
T3
T4
T5
24 T15
T4
T5
23 T14
23 T14
IMP5226
IMP5226
HEAT SINK / GND
GND
22 HEAT SINK / GND
21 HEAT SINK / GND
20 HEAT SINK / GND
19 T13
HEAT SINK / GND
GND
22 HEAT SINK / GND
21 HEAT SINK / GND
20 HEAT SINK / GND
19 T13
HEAT SINK / GND
HEAT SINK / GND
T6 10
T7 11
T6 10
T7 11
18 T12
18 T12
T8 12
17 T11
T8 12
17 T11
T9 13
16 T10
T9 13
16 T10
VTERM 14
15 NC
VTERM 14
15 NC
5226_02a.eps
5226_02b.eps
DWP Package
DB Package
Ordering Information
Part Number
Temperature Range
Package
IMP5226CDWP
IMP5226CDWPT
IMP5226CDB
0°C to 70°C
28-pin Plastic SOWB
0°C to 70°C
0°C to 70°C
0°C to 70°C
Tape and Reel, 28-pin Plastic SOWB
28-pin Plastic SSOP
IMP5226CDBT
Tape and Reel, 28-pin Plastic SSOP
5226_t01.at3
Absolute Maximum Ratings1
TermPwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . +7V
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . 0V to +7V
Operating Junction Temperature . . . . . . . . . . 150°C
Storage Temperature Range . . . . . . . . . . . . . . –65°C to 150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . 300°C
Note: 1. Exceeding these ratings could cause damage to the device. All
voltages are with respect to Ground. Currents are positive
into, negative out of the specified terminal.
Thermal Data
DWP Package
Thermal Resistance Junction-to-Leads, θJL . . . . . . . . 18°C/ W
Thermal Resistance Junction-to-Ambient, θJA . . . . . . 40°C/ W
DB Package
Thermal Resistance Junction-to-Ambient, θJA . . . . . . 117°C/ W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the
device/ pc-board system. All of the ambient airflow is assumed.
2
408-432-9100/ www.impweb.com
© 2000 IMP, Inc.
A1PROS [ A1 PROS CO., LTD. ]
