IMP5241/42/431
Package Dimensions
DB
Inches
Min
Plastic (SSOP) Widebody SOIC (36-Pin)
Millimeters
Max
Min
Max
Plastic (SSOP) Widebody SOIC (36-Pin)
A
B
0.084
0.011
0.0091
0.598
0.291
0.100
0.020
0.0125
0.606
0.299
2.14
0.29
0.23
15.20
7.40
2.54
0.51
0.32
15.40
7.60
36
1
19
C
E
P
D
18
E
F
0.031 BSC
0.80 BSC
D
G
H
0.004
0.096
0.016
0°
0.012
0.104
0.050
8°
0.10
2.44
0.40
0°
0.30
2.64
1.27
8°
E
F
M
A
H
L
L
C
SEATING PLANE
B
G
M
P
36-Pin (SSOP).eps
0.398
–
0.414
0.004
10.11
10.51
0.10
*LC
–
PW
Thin Small Shrink Outline (TSSOP) (28-Pin)
Thin Small Shrink Outline (TSSOP) (28-Pin)
A
B
.032
0.007
0.0035
0.378
0.169
.041
0.012
0.0079
0.386
0.176
0.80
0.19
0.09
9.60
4.30
1.05
0.30
0.20
9.80
4.5
C
D
E
E
P
F
0.025 BSC
0.65 BSC
6.40 BSC
G
H
0.002
–
0.005
0.047
0.030
8°
0.05
–
0.15
1.20
0.75
8°
1
2 3
L
0.017
0°
0.45
0°
E
M
P
D
F
0.25 BSC
0.004
A
*LC
–
–
0.10
H
M
L
Thin Small Shrink Outline (TSSOP) (24-Pin)
SEATING PLANE
B
G
C
A
B
.032
0.007
0.0035
0.303
0.169
.041
0.012
0.0079
0.311
0.176
0.80
0.19
0.09
7.70
4.30
1.05
0.30
0.20
7.90
4.5
28-Pin (TSSOP).eps
C
PW
D
Thin Small Shrink Outline (TSSOP) (24-Pin)
E
F
0.025 BSC
0.65 BSC
G
H
0.002
–
0.005
0.047
0.030
8°
0.05
–
0.15
1.20
0.75
8°
L
0.017
0°
0.45
0°
E
P
M
P
0.246
–
0.256
0.004
6.25
–
6.50
0.10
1
2 3
*LC
* Lead Coplanarity.
5241/42_t01.eps
E
D
F
A
H
M
L
SEATING PLANE
B
G
C
24-Pin (TSSOP).eps
ꢀr
9
© 2001 IMP, Inc.
Data Communications
A1PROS [ A1 PROS CO., LTD. ]
