IMP5241/42/431
Pin Configuration
SSOP-36
TSSOP-28
TSSOP-24
1
2
V
TERM
28
NC
1+
1
2
NC
NC
36
V
TERM
27 NC
1
2
24
V
TERM
1+
35 HVD
23 NC
26
25
1–
3
4
5
6
9–
1–
2+
34
3
4
5
6
LVD
NC
1+
1–
2+
9+
22
3
4
5
6
9–
2+
2–
3+
3–
33
32
SE
9–
24 8–
2–
NC
21
20
9+
23 8+
8–
IMP5243
31 9+
19 8+
22
7
8
NC
3+
30
29
IMP5241/42
7
8
8–
8+
2–
HEATSINK
HEATSINK
HEATSINK
3–
21 7–
18
17
7
8
7–
4+
4–
5+
5–
7+
20
19
9
7+
4+
4–
5+
5–
9
28 HEATSINK
27 HEATSINK
IMP5241/42
9
16 6–
10
11
12
6–
10
10
15 6+
18 6+
26
11
HEATSINK
3+
17 DIFF B
14
11
DIFFSENSE
DISCONNECT
3– 12
25 7–
GND 12
13 MASTER/SLAVE
16
13
DIFFSENSE
DISCONNECT
24
23
13
14
15
16
7+
6–
4+
4–
5+
5–
GND 14
15 MASTER/SLAVE
5241/42_03.eps
DW Package
5243_02.eps
22 6+
21 DIFF B
20
17
DIFFSENSE
DISCONNECT
GND 18
19 MASTER/SLAVE
DB Package
5241/42_02.eps
Ordering Information
Part Number
IMP5241CDB
IMP5242CDB
IMP5241CPW
IMP5242CPW
IMP5243CPW
Temperature Range
0°C to 70°C
Package
36-pin Plastic SSOP
36-pin Plastic SSOP
24-pin Plastic TSSOP
24-pin Plastic TSSOP
28-pin Plastic TSSOP
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
5241/42_t02.eps
Note:
For Tape and Reel, append the letter “T” to part number. (i.e. IMP5241CDBT)
Absolute Maximum Ratings1
TermPwr Voltage . . . . . . . . . . . . . . . . . . . . . . . . +7V
Operating Junction Temperature
Lead Temperature (Soldering, 10 sec.) . . . . . . 300°C
Plastic (DB, PW Packages) . . . . . . . . . . . . . 150°C
Storage Temperature Range . . . . . . . . . . . . . . –65°C to 150°C
Note: 1. Exceeding these ratings could cause damage to the device. All
voltages are with respect to Ground. Currents are positive
into, negative out of the specified terminal.
Thermal Data
Junction Temperature Calculation: TJ = TA + (PD x θJA).
DB Package:
The θJA numbers are guidelines for the thermal performance of
the device/pc-board system. No ambient airflow is assumed.
Thermal Resistance Junction-to-Ambient, θJA . . . . . . 50°C/W
PW Package:
Thermal Resistance Junction-to-Ambient, θJA . . . . . . 100°C/W
ꢀr
2
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© 2001 IMP, Inc.